March 17 (Reuters) – Huawei Technologies Co Ltd’s (HWT.UL) founder stated that the enterprise has replaced additional than 13,000 components in its goods that have been hit by U.S. trade sanctions, according to a transcript of a speech posted on Friday by a Chinese university.
According to the transcript posted by Shanghai Jiao Tong University, Huawei founder Ren Zhengfei stated Huawei had more than the previous 3 years replaced the 13,000 elements with domestic Chinese substitutes and had redesigned four,000 circuit boards for it goods. He stated production of circuit boards had “stabilized.”
The remarks, which Reuters could not independently confirm, supplied a window into Huawei’s efforts to bounce back from U.S. trade restrictions. Due to the fact 2019, Huawei, a main supplier of gear utilized in 5G telecommunications networks, has been the target of successive rounds of U.S. export controls.
These controls reduce off each Huawei’s provide of chips from U.S. organizations and its access to U.S. technologies tools to style its personal chips and have them manufactured by partners. The Biden administration final year also banned the sale of new Huawei gear in the U.S.
Ren produced the remarks in a speak to Chinese technologies specialists on Feb. 24, the university stated. The university posted the transcript on its web site on Friday. A U.S.-primarily based Huawei representative did not promptly respond to a request for comment on Friday.
Ren stated Huawei invested $23.eight billion in R&D in 2022, and “as our profitability improves, we’ll continue to enhance R&D spending.”
The reports come immediately after analysts stated that Huawei showed off 5G telecommunications gear at an sector conference in Barcelona in which all of the chips on its circuit boards had their origins obscured.
Reporting by Stephen Nellis in San Francisco and Krystal Hu in New York Editing by Cynthia Osterman
Our Requirements: The Thomson Reuters Trust Principles.