• Tue. Apr 23rd, 2024

Japanese Semiconductor Giant Rapidus Aims to Launch 2nm Process Technology by 2027 with $3.89 Billion in Funding

BySamantha Nguyen

Apr 3, 2024
Rapidus secures $3.9 billion in government funding for 2nm and multi-chiplet technologies

Japanese-based Rapidus is working on developing 2nm process technology, with plans to launch it commercially in 2027. To support its ongoing projects, the company has received a substantial grant of ¥590 billion yen ($3.89 billion) from the Japanese government. This funding will be used towards developing the 2nm production node and purchasing cleanroom equipment as well as towards the development of multi-chiplet packaging technology.

With the government’s total support now at ¥920 billion ($6.068 billion), Rapidus is receiving a major boost towards achieving its goals in the semiconductor industry. Despite the hefty project cost estimate of around ¥5 trillion ($32.983 billion), the company is hopeful that with the backing of the Japanese government and support from prominent Japanese companies like Toyota Motor and Nippon Telegraph and Telephone, it will secure enough financing to move forward.

Rapidus’s CEO, Atsuyoshi Koike, has outlined the company’s timeline for developing its production capabilities, with plans to initiate testing by April 2025 and hopes for large-scale production to begin by 2027. Commercial production of 2nm chips is expected to kick off in 2025.

In addition to working on the 2nm fabrication process in partnership with IBM and constructing its manufacturing facility, Rapidus is also focusing on advanced packaging technology for multi-chiplet System-in-Packages (SiPs). The recent government subsidies include more than ¥50 billion ($329.85 million) specifically allocated for research and development in this area, marking the first time Japan has offered subsidies for such technologies.

Another interesting development is Rapidus’s use of a portion of Seiko Epson Corporation’s Chitose Plant, located in Chitose City, Hokkaido, for its back-end packaging processes. This facility is in close proximity to the company’s fab currently under construction in Bibi World, an industrial park in Chitose City, slated for use in pilot-stage research and development activities.

Overall, Rapidus’s progress towards commercializing next-generation semiconductor technology is a significant step forward for Japan’s electronics industry and highlights continued investment from both private sector companies and government agencies in cutting edge research and development initiatives.

By Samantha Nguyen

As a content writer at newsqwe.com, I am passionate about crafting engaging and informative articles that captivate our audience. With a background in journalism and a keen eye for detail, I strive to deliver content that is not only well-researched but also adds value to our readers' lives. From breaking news stories to in-depth features, I take pride in my ability to tell compelling stories that resonate with our diverse audience. When I'm not typing away at my keyboard, you can find me exploring new cafes, practicing yoga, or getting lost in a good book. I am thrilled to be a part of the newsqwe.com team and look forward to sharing my love for writing with all of our readers.

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